KuMgangatho oPhezulu, iGlasi yeBorosilicate eZinzileyo yeGlasi 3.3: iChip egqibeleleyo yeSemiconductor

Intshayelelo yeMveliso

Iimpawu eziphambili zeglasi ye-borosilicate ephezulu ye-3.3 zezi: akukho ukuxutywa, okungeyona inetyhefu, ukunambitha; Ukucaca kakuhle, ukucoceka kunye nenkangeleko enhle, umqobo olungileyo, ukuphefumula, izinto eziphezulu zeglasi ze-borosilicate, zineenzuzo zokuxhathisa ubushushu obuphezulu, ukumelana nomkhenkce, ukumelana noxinzelelo, ukuchasana nokucoca, kungekhona nje ukuba i-bacteria ephezulu yokushisa, inokugcinwa kwiqondo lokushisa eliphantsi. Iglasi ephezulu ye-borosilicate ikwabizwa ngokuba yiglasi enzima, yinkqubo ephucukileyo eyenziweyo.
Iglasi yeBorosilicate 3.3 luhlobo lweglasi ekhethekileyo esetyenziselwa izicelo ezininzi zoshishino nezesayensi. Inokumelana nokothuka okukhulu kwe-thermal kuneglasi eqhelekileyo, evumela ukuba isetyenziswe kwizicelo ezininzi ezahlukeneyo ezifana nezixhobo zelabhoratri, izixhobo zonyango, kunye neetshiphusi zesemiconductor. Iglasi ye-Borosilicate 3.3 inika kwakhona ukuqina okuphezulu kweekhemikhali kunye nokucaca kwe-optical xa kuthelekiswa nezinye iintlobo zeeglasi.

Iimpawu

Ukuchasa okubalaseleyo kwe-thermal
Ukungafihli okugqithisileyo
Ukuqina okuphezulu kweekhemikhali
Amandla omatshini abalaseleyo

Iingenelo

Xa kufikwa kusetyenziso lwetekhnoloji ye-borosilicate yeglasi semiconductor chip, kukho iingenelo ezininzi kwesi sixhobo ngaphezulu kweetshiphusi ezisekelwe kwi-silicon.
I-1.Borosilicate inokusingatha amaqondo obushushu aphezulu ngaphandle kweepropati zayo ezichatshazelwa bubushushu okanye utshintsho loxinzelelo olufana ne-silicon xa ibonakaliswe kwiimeko ezinzima. Oku kubenza balungele ubushushu obuphezulu be-elektroniki kunye nezinye iimveliso ezifuna ulawulo oluchanekileyo lobushushu-ezifana neentlobo ezithile zeelaser okanye oomatshini be-x-reyi apho ukuchaneka kufuneka kube yeyona nto iphambili ngenxa yobume obunokuba yingozi bemitha abayikhuphayo ukuba ayiqulathanga ngokufanelekileyo ngaphakathi kwezixhobo zabo zokuhlala.

Amandla amangalisayo e-2.Borosilicate athetha ukuba ezi chips zinokwenziwa zibe bhityile kakhulu kunezo zisebenzisa ii-silicone wafers – idibaniso enkulu kuso nasiphi na isixhobo esidinga ubunakho bokwenza i-miniaturization efana nee-smartphones okanye iitafile ezinesithuba esinqongopheleyo ngaphakathi kuzo kumacandelo afana neeprosesa okanye iimodyuli zememori ezifuna isixa esikhulu samandla ukanti zineemfuno zevolumu ephantsi ngaxeshanye.

ukutyeba Processing

Ubukhulu beglasi buqala kwi-2.0mm ukuya kwi-25mm,
Ubungakanani: 1150 * 850 1700 * 1150 1830 * 2440 1950 * 2440
Max.3660*2440mm, Obunye ubungakanani obulungiselelweyo buyafumaneka.

Iyaqhuba

Iifomathi zokusikwa kwangaphambili, ukusetyenzwa komphetho, ukuthambisa, ukugrumba, ukugquma, njl.

Ipakethe kunye noThutho

Ubuncinci be-odolo yobuninzi: iitoni ezi-2, umthamo: iitoni ezingama-50 / ngosuku, indlela yokupakisha: isitya somthi.

Ukuqukumbela

Okokugqibela, iipropathi ezigqwesileyo zokufakelwa kombane ze-borosilicates zibenza babe ngabaviwa ababalaseleyo boyilo lwesekethe ezintsonkothileyo apho ukugquma phakathi komaleko ngamnye kubalulekile ukuze kuthintelwe iisekethe ezimfutshane ezenzeka ngexesha lokusebenza - into ebaluleke ngakumbi xa ujongana nombane ophezulu onokuthi ubangele umonakalo ongenakulungiseka ukuba uvunyelwe imisinga engaqwalaselwanga ehamba kwiindawo ezinobuthathaka ebhodini. Konke oku kudityaniswa ukwenza iglasi ye-borosilicate 3.3 ibe sisisombululo esifanelekileyo ngalo lonke ixesha ufuna imathiriyeli eyomelele kakhulu esebenza ngokuthembekileyo phantsi kweemeko ezimandundu ngelixa ibonelela ngeempawu ezikhethekileyo zokwahlulwa kombane. ngenxa yokuba ezi zixhobo azikhathazwa yi-oxidation (i-rusting) njengezinto zentsimbi ezizenzayo, zilungele ukuthembeka kwexesha elide kwiindawo ezibuhlungu apho ukuvezwa kunokukhokelela kwiintsimbi eziqhelekileyo ukubola ngokuhamba kwexesha.